HiLink develops hardware and software for connectivity solutions in telecommunications, information technology, and home automation.
HiLink has raised $5.0M in total funding. The most recent round was Seed. The last funding was announced in July 2024.
HiLink's investors include Corazon Capital, Mudita Venture Partners, Eddie Lou.
HiLink is headquartered in Chicago, United States.
HiLink develops hardware and software for connectivity solutions in telecommunications, information technology, and home automation.
HiLink is at the Seed stage.
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"HiLink — Funding & Investors." VCBacked, July 22, 2024, https://www.vcbacked.co/company/hilink. Accessed October 31, 2026.
VCBacked. (2024). HiLink — Funding & Investors. Retrieved October 31, 2026, from https://www.vcbacked.co/company/hilink
{{cite web |title=HiLink — Funding & Investors |url=https://www.vcbacked.co/company/hilink |website=VCBacked |access-date=October 31, 2026}}Profile data sourced and verified per the VCbacked methodology · Last funding round dated