AI-powered lightweight IoT platform delivering real-time insights, automation, security, and scalability.
Thinctechnology has raised $124K in total funding. The most recent round was Series A. The last funding was announced in January 2025.
Thinctechnology is headquartered in Los Angeles, United States.
AI-powered lightweight IoT platform delivering real-time insights, automation, security, and scalability.
Thinctechnology is at the Series A stage.
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"Thinctechnology — Funding & Investors." VCBacked, January 15, 2025, https://www.vcbacked.co/company/thinctechnology. Accessed August 17, 2026.
VCBacked. (2025). Thinctechnology — Funding & Investors. Retrieved August 17, 2026, from https://www.vcbacked.co/company/thinctechnology
{{cite web |title=Thinctechnology — Funding & Investors |url=https://www.vcbacked.co/company/thinctechnology |website=VCBacked |access-date=August 17, 2026}}Profile data sourced and verified per the VCbacked methodology · Last funding round dated