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Advanced Packaging Design Engineer

AttoTude · AttoTude develops interconnect technology for artificial intelligence and hyperscale data center environments.

Ottawa, ON101-250 employeesPosted 26 days ago
Series C · $52Mraised 4 months agoled by Mayfield Fund, Wing Venture Capital, Canaan Partners

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<p></p> <div><strong><span data-olk-copy-source="MessageBody">Role Description</span></strong></div> <div>This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.</div> <div>&nbsp;</div> <div><strong>Qualifications</strong></div> <ul> <li> <div>Experience in advanced silicon packaging,&nbsp;multichip module and high-speed interposer designs as well as solid understanding of assembly process.</div> <div> <div>Mechanical, thermal and FEA modeling and design experience.</div> </div> </li> <li> <div>Proven track-record of product development, from concept through volume production.&nbsp;</div> </li> <li> <div>Ability to work effectively in cross-disciplinary teams and drive technical collaborations.</div> </li> <li>Excellent analytical and problem-solving skills.</li> <li>Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.</li> </ul> <p></p> <p>&nbsp;</p>
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